Class
2619
Manufacture of other electronic components and boards
ISIC Rev. 5 (2026) international industry classification: full UN hierarchy from section to class, updated for 2026, with SSIC crosswalk links.
In this group: sibling classes
Official data
| Classification | ISIC Rev. 5 (2026) |
| Authority | United Nations Statistics Division (UNSD) |
| Purpose | ISIC Rev. 5 (2026) international industry classification: full UN hierarchy from section to class, updated for 2026, with SSIC crosswalk links. |
| Published | Rev. 5 |
| Source | UNSD ISIC Rev. 5 |
Mapped from SSIC 2025
SSIC 2025 26111 Manufacture of discrete devices SSIC 2025 26112 Semiconductor wafer fabrication SSIC 2025 26113 Assembly and testing of semiconductors SSIC 2025 26119 Manufacture of semiconductor devices n.e.c. SSIC 2025 26121 Manufacture of capacitors SSIC 2025 26122 Manufacture of printed circuit boards without electronic parts SSIC 2025 26123 Manufacture of printed circuit boards with electronic parts SSIC 2025 26124 Manufacture of piezo-electric devices SSIC 2025 26125 Manufacture of electronic display devices (except light emitting diodes) SSIC 2025 26126 Manufacture of electronic connectors SSIC 2025 26129 Manufacture of other electronic components and boards n.e.c.
Mapped SSIC classes
SSIC hierarchy context
Related SSIC divisions
No division context found.
Related SSIC sections
No section context found.
Full SSIC mapping
Table SSIC 2025 to ISIC Rev. 5 Full correspondence table with all mappings.
Follow the links to move from the international class back into Singapore SSIC hierarchy at multiple levels.
Data source: United Nations Statistics Division (https://unstats.un.org/unsd/classifications/Econ/Download/In%20Text/ISIC_Rev_5_english_structure.xlsx). ISIC Rev. 5 structure mirrored from official UN XLSX.
Version: ISIC Rev. 5.