SSIC 2025 sub-class
Manufacturing Verified · 15 Apr 202528273
Manufacture/repair of semiconductor assembly and testing equipment
This sub-class includes the manufacture, repair and/or maintenance of semiconductor assembly and/or packaging machinery, such as computer burn-in systems.
Level
final
Mapped ISIC codes
2
Source
SingStat
In this section: sibling codes
Official data
| Official name | Singapore Standard Industrial Classification (SSIC 2025) |
| Issuing authority | Department of Statistics Singapore (SingStat / DOS) |
| Tax authority | Inland Revenue Authority of Singapore (IRAS) (IRAS) |
| Purpose | Mandatory at ACRA business/company registration; used by IRAS, MOM, EDB, SingStat |
| Active version | SSIC 2025 (15 Apr 2025) |
| Hierarchy level | Sub-class (5-digit) (final leaf) |
| Source | https://www.singstat.gov.sg/standards/standards-and-classifications/ssic |
| Prior versions | SSIC 2020, SSIC 2015 |
Hierarchy context
Parent division
28 MANUFACTURE OF MACHINERY AND EQUIPMENTParent section
C MANUFACTURINGCorrespondence tables
ISIC crosswalk
Alphabetical index entries
Principal Title 28273 Manufacture/repair of semiconductor assembly and testing equipment Alternative Title 28273 Burn-in board and system manufacturing (standard and custom design) Alternative Title 28273 Burn-in board and system repair and maintenance (standard and custom design) Alternative Title 28273 Computer burn-in system manufacturing Alternative Title 28273 Computer burn-in system repair and maintenance Alternative Title 28273 Manufacture of semiconductor computer burn-in systems
Data source: Department of Statistics Singapore (SingStat / DOS) (https://www.singstat.gov.sg/standards/standards-and-classifications/ssic). Official SSIC 2025 classification workbook.
Last data refresh: 15 Apr 2025. Classification version: SSIC 2025.
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